Semiconductor Fabrication

Precision That Scales with Your Technology

Semiconductor manufacturing demands extreme control over substrate geometry and surface quality as device features continue to shrink and process windows tighten. Small deviations in flatness or surface condition can directly impact yield, overlay accuracy, and tool performance.

Total Thickness Variation (TTV) correction and extreme flatness are critical for wafers, masks, and optical components used in lithography, inspection, and metrology. QED Technologies’ Magnetorheological Finishing (MRF™) technology provides deterministic, sub-micron material removal, enabling precise TTV correction while maintaining tight global and local flatness.

Metrology and Polishing Systems Built for Tomorrow’s Nodes

As critical dimensions decrease, microroughness, surface quality, and optical scatter become increasingly important. MRF delivers angstrom-level surface finishes without introducing subsurface damage, supporting high-performance optical systems.

Equally important is defect-free patterning. QED Technologies’ metrology systems provide high-resolution feedback on surface form and defects, enabling closed-loop correction and consistent process control. Together, QED Technologies’ metrology and MRF platforms help semiconductor manufacturers achieve the precision and repeatability required for advanced device fabrication.

Let’s Talk About Your Precision Needs

Connect with our team to explore solutions tailored to semiconductor manufacturing.